Synopsys

Synopsys is looking for an Advanced Packaging Technologist and Mechanical Engineer who will help to develop 3DIC and advanced packaging solutions for Synopsys IP and test chip to meet performance and reliability requirements, come up with design guidelines and best practice, and help customers explore their package solution space options. Candidate with advanced packaging technology, assembly process flow, material selection, TSV, and their impact to package reliability experience required. Can-do attitude, quick learning, and solid electronic skills are assets. You will be working with a global, highly skilled and very supportive team. 

Responsibilities 

• Foundry and OSAT interface person for 3DIC and advanced packaging vendor evaluation, technology selection, feasibility study, design, manufacturing, assembly, test, and qualification
• Drive internal cross-functional teams for 3DIC, interposer and substrate design and development from packaging technology perspective
• Perform mechanical (stress and warpage) simulation to for IP sign off, come up with integration design guideline, best practice
• Drive IP and chiplet development from DFM an DFR perspective, material selection, cross-section, die thickness, die-stacking, TSV placement, bonding pad design
• Drive internal 3DIC tool feature development and validation to meet IP group needs
• Market study of emerging packaging technology development, competitive analysis, and recommendation to our package development direction
• Pre- and Post-IP sales packaging technology support

Requirements 

• Knowledge and experience with TSMC 2.5D/3D/3.5D heterogeneous integration technologies such as SoIC, CoWoS, WoW. 
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.

Nice to have: 

• Knowledge and experience with advanced packaging, 3DIC offering from different foundries and OSAT: EMIB, xCUBE from Samsung, ASE/SPIL/Amkor
• EMIB, xCUBE and OSAT solutions
• Good to have substrate and interposer design experience/exposure, SIPI knowledge to understand trade-offs among electrical, thermal and mechanical requirement    
• Mechanical and multi-physics modeling and simulation with Ansys tools

The Team You’ll Be A Part Of:
You will be part of a dynamic and innovative team dedicated to pushing the boundaries of 3DIC and advanced packaging technologies. Our team is composed of experts in SIPI, silicon design, and advanced packaging who work collaboratively to develop cutting-edge solutions. Together, we strive to deliver exceptional results and drive the future of technology.

Rewards and Benefits:
 We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about benefits during the hiring process.

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Inclusion and Diversity are important to us. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, military veteran status, or disability.

In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.